The 5G market is expanding rapidly, and consumer electronics is breaking through new innovations. At the mobile phone level, 5G smartphones are currently in fierce competition for technology and product quality among domestic and foreign electronics manufacturers. With the development of smartphones, there will also be some problems:
- Implementation of 5G cell towers and massive MIMO based on high-frequency millimeter waves
- The demand for lighter, thinner and faster devices is becoming denser with the circuitry within the devices
-Increased demand for lighter, thinner and better elongation for thermal management materials
Managing heat and temperature in these systems is critical to extending service life, especially for components. Beginor Material is confident that it can provide customers with any solution for smartphone adhesives
【Camera module bonding】
 | BEEP 6618 one-component, low-temperature epoxy adhesive ◇ High adhesion ◇ Low water absorption ◇ It can be applied to the bonding of a variety of materials ◇ It has good storage stability |
【PCB Triple Coating】
BECOAT 9007 Silicone Triple Conformal Coating Adhesive ◇ One-component room temperature silicone ◇ Can be heated and cured ◇ Medium viscosity, suitable for brushing, spraying, dipping and other processes ◇ After curing, a transparent elastic protective film with a certain hardness and anti-wear is formed ◇ Good adhesion to various circuit boards ◇ Good high and low temperature resistance and flame retardant performance |  |
【Touch screen film lamination】
 | BEGEL 8602 Optical Silicone A/B Silicone Liquid Optical Adhesive ◇ 1:1 mixing convenience ◇ High light transmittance ◇ Low yellowing ◇ Room temperature curing or heat curing ◇ High toughness and surface viscosity ◇ Manufacturability is more optimized |
【Chip underfill】
BEGEL 9500 Chip Encapsulated Gel ◇ One-component direct dispensing, no need to mix ◇ No need for ultra-low temperature storage ◇ High purity, low ring content is very small ◇ Low viscosity and excellent foaming ability ◇ It can work in a wide range of operating temperatures, -80-230 °C |  |
【Sensor Bonding and Fixing】
| BESIL 8230A/B Thermally Conductive Flame Retardant Encapsulant ◇ Two-component additive molding silicone rubber ◇ 1:1 mixing ratio ◇ Low hardening shrinkage ◇ Excellent high temperature electrical insulation and stability ◇ Good waterproof and moisture resistance |
【TYPE -C Connector】
BESIL 9102B one-component addition heat-curing silicone ◇ One-component fluid, rapid heating and curing ◇ Passed ROHS\ REACH\ UL certification ◇ Bonding to a large number of substrates, such as stainless steel, plastic, glass, ceramic, etc., without primer ◇ Excellent flexibility and tear resistance ◇ Additive curing system: no curing by-products |
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【Speaker Bonding】
 | BEPU 5103 A/B Fast Cure Polyurethane Adhesive ◇ It can be dispensed by machine or mixed by hand ◇ 30mins at room temperature for fast curing ◇ Strong adhesion to various substrates ◇ High toughness and elasticity ◇ Excellent aging resistance and chemical resistance |
【Power device heat dissipation】
BESIL TP GEL 35 is a one-component curable thermally conductive cement ◇ Thermal conductivity 1.5~4.0 W/m.K optional ◇ 60°C/20 min, or 25°C/2~3 days curing ◇ Good temperature resistance ◇ Low compressive force application ◇ Automatic operation can be realized |  |
