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Automotive Electronics

Application solution of automotive electronic adhesive Silicone ECU heat conduction for bonding electronic module of body control, and silicone hybrid inverter heat conduction adhesive sealant for potting and coating.
RELEVANT DATA

Electronic (power) module Baigao adhesive application solution


An electronic module refers to an electronic system composed of electronic components, which can achieve specific functions, such as control, recording, display, etc. Electronic modules are usually composed of multiple electronic components, such as resistors, capacitors, transistors, integrated circuits, etc., which can achieve specific functions, such as control, recording, display, etc



The application of Beginor Material in electronic modules



Higher voltage output, higher power density, and faster switching speeds are trending trends that require more advanced thermal conductivity solutions for electronic systems that drive power supplies and modules. Baygo adhesives can help dissipate heat and improve the reliability of even the most powerful high-density semiconductors. From microinverters and power optimizers to computer servers and power supplies, improved thermal management is a universal requirement for the long-term performance and reliability of power supplies and modules. Baygo encapsulants offer superior heat resistance, are thin and lightweight, and are ideal for filling uniquely shaped gaps and create a large contact area for maximum thermal conductivity


【ECU potting】



BECOAT 9060 SILICONE CONFORMAL ADHESIVE/COATING ADHESIVE


● Reworkable, protection grade IP65 level

● Low viscosity eco-friendly fluid, solid content 100%

● Contains fluorescent indicator, which can be inspected after sizing

● Good adhesion and no corrosion.

● Stable and elastic at -60°C—280°C

● Excellent dielectric properties


ecu


【Power module thermal conductivity potting】


【电源模块导热灌封】

BEPU 6650 A/B High Thermal Conductivity Two-Component Polyurethane Encapsulant


● Low viscosity and strong operability

● Excellent low temperature characteristics and excellent weather resistance

● Thermal conductivity index up to 1.2W/m.K

● Excellent electrical insulation and stability

● Good adhesion to most metals and plastics



GLUE GUIDE
PRODUCTAPPLICATION
EXAMPLE 
PRODUCT CATEGORYPRODUCT TYPECURING
CONDITION
APPLICATION
BEGEL 8605RegulatorSiliconeTwo-componentRoom temperature curingPcb chip protection
BESIL 9446RegulatorSiliconeOne componentRoom temperature curingHeat sink and shell bonding
BESIL 9445RegulatorSiliconeOne componentRoom temperature curingCeramic substrate and heat sink bonding
BEEP
621
RegulatorEpoxyTwo-componentHeat curingCeramic substrate and heat sink bonding
BEGEL 8605Ignition moduleSiliconeTwo-componentRoom temperature curingPcb board protection
BESIL 8125Ignition moduleSiliconeTwo-componentRoom temperature curingPcb board fill protection
BECOAT 921LPCB Conformal coatingSiliconeOne componentRoom temperature curingPCB coating
BECOAT 921LECU control moduleSiliconeOne componentRoom temperature curingPCB coating
BEGEL 8605ECU control moduleSiliconeTwo-componentRoom temperature curingPcb board protection
BEPU 6127ECU control modulePolyurethaneTwo-componentRoom temperature curingPCB potting protection
BESIL N9339ECU control moduleSiliconeOne componentRoom temperature curingShell sealing
BESIL 9003ECU control moduleSiliconeOne componentRoom temperature curingShell sealing
BECOAT 921LCharging pileSiliconeOne componentRoom temperature curingPCB coating
BESIL 8230-12Charging pileSiliconeTwo-componentRoom temperature curingInductive potting
TP 200Charging pileSiliconeOne componentRoom temperature curingInductor cooling protection
BEEP 6225DC contactorEpoxyTwo-componentRoom temperature curingPotting protection


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