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Encapsulant

Encapsulant_Potting Compounds_Silicone_Polyurethane_Epoxy
EP 6225(62a) A/B heat-curing encapsulant

EP 6225A / B is a two-component solvent less, room temperature curing epoxy potting material for automotive, automotive electronics, power tools, reactors, instruments with high thermal conductivity requirements of the product package protection, and ha
  • Excellent adhesion,anti-cracking

  • Low CTE linear expansioncoefficient

  • Having a high thermalconductivity

  • Excellent electrical insulation,stability

  • Long-term use at 150 ℃ -180℃

  • Very low water absorption, good waterproof, moistureresistance

  • Flame retardancy


Used for automotive, automotive electronics, power tools, reactors, instruments with high thermal conductivity requirements of the product package protection.

If you need to know more about the product information, 

you can get it from the following ways: 

◇ Click to leave a message online; 

◇ Send an email to marketing@shbeginor.com ; 

◇ Call the hotline 021-67227200; 

◇ Contact BEGINOR sales staff and distributors directly;


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